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filingDate 2022-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_795232694cd1f685ea91a0e67ff494fa
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publicationDate 2022-06-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-114591090-A
titleOfInvention Silicon nitride ceramic substrate for circuit and preparation method thereof
abstract The invention relates to the field of ceramic substrates, provides a silicon nitride ceramic substrate for circuits and a preparation method thereof, and solves the problem that silicon nitride ceramics with high dimensional accuracy, high toughness and high thermal conductivity cannot be obtained by the preparation method of the prior art. The problem of the substrate; including the following preparation steps: (1) casting slurry preparation; (2) casting molding: the casting slurry is prepared into a casting green belt through a casting machine; (3) punching and forming: (4) lamination; (5) debinding; (6) high temperature gas pressure sintering; wherein, the α-Si 3 N 4 The dosage ratio of the powder to the sintering aid is 90-96:4-10 in weight percentage; the α-Si 3 N 4 powder is prepared by a self-propagating method.
priorityDate 2022-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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