abstract |
The present invention provides a sheet for manufacturing a semiconductor device comprising a substrate, an adhesive layer, an intermediate layer, and a film-like adhesive, wherein the sheet for manufacturing a semiconductor device is formed by sequentially laminating the adhesive layer on the substrate. , the intermediate layer and the film-like adhesive, and the intermediate layer contains a non-silicon-based resin having a weight average molecular weight of 100,000 or less as a main component. |