Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a712ec2deb82b4cf9c1c7b172a7180e3 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K9-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-6834 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2363-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2463-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2429-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-562 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L29-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
filingDate |
2021-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3754f949d6067a83b1a8ebfd55e65624 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_867f042232a7aa8488e538903199d7c1 |
publicationDate |
2022-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
CN-114585683-A |
titleOfInvention |
Thermosetting resin film, composite sheet, and method for producing semiconductor chip with first protective film |
abstract |
The present invention provides a thermosetting resin film using the thermosetting resin film having a size of 10 mm×10 mm×1 mm as a first test piece, from which the first test piece is put into a belt of an automatic curing time measuring apparatus “MADOKA” The gelation time was 300 s or more from the time when the grooved sample holder was heated to the stainless steel plate at 180° C. to the time when the torque of the stirring blade reached 2.5 gf·cm during heating and stirring using the stirring blade. |
priorityDate |
2020-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |