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filingDate 2022-02-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2022-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2022-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-114561176-B
titleOfInvention Solvent-free high-elastic epoxy pouring adhesive for repairing active cracks in concrete and preparation method
abstract The solvent-free high-elastic epoxy pouring glue for repairing active cracks in concrete and the preparation method of the present invention belong to the field of pouring glue. The pouring glue is formed by mixing component A and component B, and component A includes epoxy resin and modified ring Oxygen polymer, B component includes complex amine curing agent and modified rubber elastomer; modified epoxy polymer is composed of 3‑glycidyl etheroxypropylmethyldimethoxysilane and hydroxyl-terminated silicone resin Reaction in the system, the reaction is the reaction of methoxy and silanol. The modified epoxy polymer introduces silicone into the epoxy potting glue to improve the flexibility of the overall structure, and the prepared potting glue has good elasticity. The modified rubber elastomer has excellent compatibility with the compound amine curing agent, and can also participate in the curing reaction of epoxy resin, which can effectively improve the elasticity and mechanical properties of the epoxy cured product, and has strong resistance to deformation. The viscosities of components A and B are low, the glue is easy to mix, and the operation process is good. The obtained pouring glue has high bonding strength with concrete.
priorityDate 2022-02-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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