| abstract |
The subject of this invention is to provide the manufacturing method of the printed wiring board which can form a small diameter through-hole, is excellent in stain removal property, and suppresses the occurrence of a halo phenomenon. The solution of the present invention is a method of manufacturing a printed wiring board, which includes, in this order: (A) a step of forming an opening in an insulating layer containing a cured product of a resin composition by a laser, and (B) using an abrasive A process in which the openings are sandblasted to form through holes. |