http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114496727-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_af239824696cb2ca9a3c6bf805ccb8ea |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02021 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B43-27 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B43-50 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-98 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-11582 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-11575 |
| filingDate | 2021-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_16e2d2165caa3041bcaa603775bb56bf http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_211c0325cbefa06eee8d42a38cd30f7f |
| publicationDate | 2022-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-114496727-A |
| titleOfInvention | Integrated circuit assembly and method of making the same |
| abstract | The present application discloses an integrated circuit assembly and a manufacturing method thereof. The manufacturing method includes: bonding a plurality of wafers, the plurality of wafers including at least a first wafer and a second wafer, trimming an edge portion of the second wafer to form a step; filling the step to form a support layer; Chemical mechanical polishing is performed on the first surface of the second wafer to obtain a flat surface, wherein the first surface of the second wafer is away from the first wafer. The integrated circuit assembly removes the edge portion of the second wafer by trimming, and uses a support layer to provide protection from a more serious problem of edge thickness being smaller than the center thickness during the chemical mechanical polishing process, so that a flat surface can be obtained. In the photolithography process Accurate focusing is possible, thereby improving the yield and reliability of integrated circuit components. |
| priorityDate | 2021-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 27.