| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a712ec2deb82b4cf9c1c7b172a7180e3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68354
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-122
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2270-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-20 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-283
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L31-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B37-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78 |
| filingDate |
2021-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_21ea8ea7adfb2a230b690a57c435b18d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_229912d8bcda301d385f55af5d20c86d |
| publicationDate |
2022-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-114467171-A |
| titleOfInvention |
Manufacturing method of semiconductor chip with film adhesive |
| abstract |
The present invention provides a method for producing a semiconductor chip with a film-like adhesive including a semiconductor chip and a film-like adhesive provided on the back surface of the semiconductor chip. Production of a semiconductor device in which an adhesive layer, an intermediate layer, and a film adhesive are sequentially laminated on a substrate, and the intermediate layer contains a non-silicon-based resin having a weight average molecular weight of 100,000 or less as a main component. A sheet for use, the manufacturing method comprising the steps of laminating a film adhesive of a sheet for manufacturing a semiconductor device to the back surface of a semiconductor chip to produce a laminate of the sheet for manufacturing a semiconductor device and a semiconductor chip; A step of irradiating the laminate along the outer periphery of the semiconductor chip with laser light to cut the film-like adhesive so as not to cut into the adhesive layer to obtain a semiconductor chip with a film-like adhesive on one side of the semiconductor chip. |
| priorityDate |
2020-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |