http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114462284-A

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filingDate 2022-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6102cc4e41a618b50cf5652505ffd6d9
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publicationDate 2022-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-114462284-A
titleOfInvention A method and device for predicting the surface grinding profile of a gallium oxide substrate
abstract The present application provides a method and a device for predicting the surface grinding profile of a gallium oxide substrate. The uniform load on the side of the gallium oxide substrate to be tested that is far away from the polishing pad is obtained, and the uniform load is input into a finite element model to obtain the gallium oxide substrate to be tested. The contact pressure between the bottom and the polishing pad is calculated according to the contact pressure, the concentration of abrasive particles, the hardness of the gallium oxide substrate to be measured, the diameter of the abrasive particles, the grinding coefficient, the grinding speed, the grinding time, and the area of the gallium oxide substrate The grinding removal rate of the gallium oxide substrate to be tested is calculated according to the grinding removal rate of the gallium oxide substrate, the original height of each part of the gallium oxide substrate and the average height of the gallium oxide substrate after grinding to obtain the arithmetic of the surface of the gallium oxide substrate Average roughness. In this way, the prediction of the surface grinding morphology of the gallium oxide substrate is realized. According to the prediction results, it can be adjusted in time to guide the actual grinding process, reduce the cost of process trial and error, obtain a surface with better flatness, reduce waste, and shorten the time from design to manufacture. cycle.
priorityDate 2022-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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