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publicationDate 2022-05-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-114426698-A
titleOfInvention A kind of ultra-low dielectric porous polyimide film and preparation method thereof
abstract A preparation method of an ultra-low dielectric porous polyimide film. The porous polyimide film adopts aromatic dianhydride and diamine as polymerized monomers, and ionic liquid 1-butyl-3-methylimidazolium tetrafluoroborate ([BMIM][BF 4 ]) as porogen A thin film of 20-40 μm was prepared by in-situ polymerization and blending, and the dielectric constant of the thin film was 1.50-2.84. The molar ratio of the total amount of amino groups involved in the polymerization process to the total amount of acid anhydride groups is 1:1, and the volume fraction of [BMIM][BF 4 ] in the entire system is 0-85 vol%. The porous polyimide film has ultra-low dielectric constant, good thermal stability, excellent hydrophobicity and wave-absorbing properties, and has broad application prospects in the fields of flexible circuit boards, microelectronic packaging, national defense, and aerospace.
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