http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114414110-A

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filingDate 2022-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_29096e01754e3d730ae622c53e48687e
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publicationDate 2022-04-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-114414110-A
titleOfInvention Micro-pressure MEMS pressure sensor chip and preparation method thereof
abstract The invention discloses a micro-pressure MEMS pressure sensor chip and a preparation method thereof, belonging to the field of sensitive elements and sensors. The chip includes: the pressure diaphragm is characterized by comprising an SOI silicon substrate, wherein a back cavity is etched on the lower surface of the SOI silicon substrate to form a square pressure diaphragm, the upper surface and the lower surface of the pressure diaphragm are provided with the same bulges, and the bulge structures on the upper surface and the lower surface form an island structure on the pressure diaphragm and are connected through a single beam structure on the upper surface of the pressure diaphragm. Compared with the prior art, the micro-pressure sensor provided by the invention has the advantages that the micro-pressure sensor can obtain higher sensitivity and linearity at the same time under a smaller chip area; the invention is more flexible in size design, is easier to integrate and is beneficial to reducing the preparation cost.
priorityDate 2022-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 30.