| abstract |
The invention belongs to the technical field of adhesives, and discloses a resin composition, a preparation method thereof and application thereof in a copper-clad plate. The resin composition comprises the following components: solid bisphenol A epoxy resin, phenol biphenyl epoxy resin, a curing agent, a heat-conducting filler, a solvent and a curing accelerator; the solid bisphenol A epoxy resin accounts for 5-15% of the total mass of the resin composition; the phenol biphenyl type epoxy resin accounts for 1-10% of the total mass of the resin composition. Due to the coordination effect of the solid bisphenol A epoxy resin and the phenol biphenyl epoxy resin in the resin composition, when the addition amount of the heat-conducting filler in the resin composition is increased, the resin composition still has good coating performance, and the manufactured copper-clad plate can keep good adhesiveness, heat resistance and insulativity. |