| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_66ed098b1ea29f2daf5aa62a60912721 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E60-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M2004-021 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-35
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M10-058
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M4-0402
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-3266
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32669
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M4-0426
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-3211
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-321
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M10-052
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-3277
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M4-139 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J37-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-35 |
| filingDate |
2021-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bb31125cb8cd7b9380a9830c036cb6e8 |
| publicationDate |
2022-04-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-114318260-A |
| titleOfInvention |
Method and apparatus for sputter deposition |
| abstract |
A method of fabricating a layer of material on a surface is disclosed. The method includes the step of generating a plasma away from at least one sputtering target in a plasma generation region and along a plasma generation axis by a helical plasma source. The helical plasma source includes (a) one or more antennas and (b) one or more permanent magnets arranged to generate a magnetic field proximate the magnets, the magnetic field being along the plasma generation axis and in the plasma generation region. The plasma causes ejection of material from the sputtering target. The method includes the step of depositing material ejected from a sputter target onto a surface of or supported by a substrate to form a layer of material on the surface. |
| priorityDate |
2020-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |