http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114307883-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_15c4372841fee83c5116de7e486aee28
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B01J13-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B01J13-20
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filingDate 2021-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9377b53ced3c1ed765484b1238df7069
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_36b5803006ec32c717fe03f58f12ce10
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publicationDate 2022-04-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-114307883-A
titleOfInvention A kind of preparation method of nickel-plated microspheres suitable for anisotropic conduction
abstract The invention provides a preparation method of silica-cored nickel-plated microspheres suitable for anisotropic conduction. The preparation method comprises the following steps: generating functional groups on the outside of the silica microspheres; activated silica microspheres; a metal nickel conductive layer is formed on the outermost layer of the silica microspheres in the environment of hydroxycarboxylic acid compounds. The nickel-plated microspheres prepared by the invention are not broken under high-intensity pressure, and the metal layer is complete without cracks, so that the microspheres can be embedded in the flexible microelectrodes, and there is a large contact area between the flexible microelectrodes to form an effective connection electrode. The problem of poor contact of the micro-electrodes after hot pressing is solved, and thus the micro-electrodes have better electrical conductivity. At the same time, the preparation method of the present invention will not bring impurities to the product, and will not cause hidden dangers to the subsequent application of the product.
priorityDate 2021-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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