http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114258202-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_298472d50e8dd59647126e188226817d |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-386 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1291 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-382 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 |
| filingDate | 2019-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0af68dd4bc43417f3d0fdd936c3f675e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e59a5f76d6e7fea7b9eae0108d2f5d46 |
| publicationDate | 2022-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-114258202-A |
| titleOfInvention | Printed circuit board processing method and printed circuit board |
| abstract | A method of processing a printed circuit board and a printed circuit board are disclosed, the method comprising providing a thin metal layer, vacuum depositing an aluminum film layer on a first surface and press polishing the aluminum film layer, providing a polylactide thin film layer having a surface roughness of one tenth to one fifth of a predetermined roughness on a second surface, depositing a silver diammine hydroxide coating on the second surface, coating a flexible support layer on the silver diammine hydroxide coating such that the third surface contacts the silver diammine hydroxide coating, the flexible support layer being formed of a metal layer, coating a dielectric layer on a fourth surface of the flexible support layer opposite the third surface, the dielectric layer being affixed with a layer of N-half doped, P-half doped or undoped semiconductor material, coating an adhesion layer on the dielectric layer, adhering the adhesion layer to the aluminum film layer, tearing off the polylactide thin film layer such that the polylactide thin film layer and the silver diammine hydroxide coating separate from the flexible support layer, printing a conductive ink on the third surface of the flexible supporting layer to form a conductive pattern layer having a predetermined pattern. |
| priorityDate | 2019-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 36.