http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114256279-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_40ff804f09858cd89272d168f78f856d http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7fe6e0f53a3645016e6dfb5300a3ca17 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C39-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14683 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C39-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14618 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-146 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-26 |
| filingDate | 2021-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8dfe0a8332d015b6b355ed984bba97ff http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a98069870129c0278dffd9ca0efcd0bd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d8b9986bba0573448be83b9d8b29ae61 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f0aac408e6fd085c132bea2f0f2bccf9 |
| publicationDate | 2022-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-114256279-A |
| titleOfInvention | Packaging method of CIS chip |
| abstract | The invention provides a method for packaging a CIS chip, which comprises the steps of attaching the CIS chip to a substrate; attaching a cover plate to a photosensitive area of the CIS chip; the bonding wire is used for realizing the connection between the bonding pad and the pin; covering the die on the substrate, and placing the CIS chip and the pins in a die position; injecting glue or plastic packaging material into the mold position to cover the exposed chip position surface, the bonding wire and the exposed CIS chip surface in the mold position; the method comprises the steps of removing a mould, then uncovering a film and picking up a wafer to complete packaging of the CIS chip, wherein the substrate is flat, removing a platform support structure, covering the mould on the substrate, placing the CIS chip and pins in a mould position, injecting glue or plastic package material into the mould position to cover the exposed chip position surface, bonding wires and the exposed CIS chip surface in the mould position, removing a cavity, improving the overall bonding force, forming thinning marks on the boundary of the chip position, and avoiding thick-path cutting, thereby improving the warping. |
| priorityDate | 2021-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID426099710 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6337073 |
Total number of triples: 22.