http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114250061-A

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01J13-02
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K5-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B01J13-02
filingDate 2020-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8dafbda04f80b45fbf243af26218bc1a
publicationDate 2022-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-114250061-A
titleOfInvention Liquid metal phase change heat absorption material
abstract The invention relates to a liquid metal phase change heat absorption material, which aims to effectively remove expansion stress generated by liquid metal in a phase change process and simultaneously avoid the phenomenon of sedimentation and delamination after a plurality of phase change materials are compounded. The liquid metal phase change heat absorption material consists of low-melting-point metal, gallium oxide, tin hydroxide and phase change microcapsules, wherein the phase change point range is 20-40 ℃. The low-melting-point metal is gallium-tin alloy, and the mass fraction of each component of the low-melting-point metal is 80% of gallium and 20% of tin; the phase change microcapsule takes paraffin as a core material and polyacrylate as a wall material, and silicon dioxide nanoparticles are compounded on the surface of the polyacrylate wall material, so that the phase change microcapsule has higher affinity with low-melting-point metal, the phase change microcapsule is conveniently and uniformly dispersed in the low-melting-point metal, and sedimentation is avoided.
priorityDate 2020-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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