http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114242570-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0aa0074f365b254e7c579c5ab713e920 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76885 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02057 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate | 2021-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_28ffbac6a459e5e93c5b4ce3a989ce6f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4dcdb3cd479f7d7bfda6ea118894a036 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2cf3e2752b5da66cbf3be92e25310a72 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3e45bb0ceb6048fca58bb7949e88f25f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_016cb0678eea7f8edef5685c31f30a43 |
| publicationDate | 2022-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-114242570-A |
| titleOfInvention | Method of forming a semiconductor structure |
| abstract | A method for forming a semiconductor structure, comprising: providing a substrate, the substrate comprising a substrate and a pad layer on the substrate; forming an initial protective layer on the substrate, the initial protective layer covering the pad layer surface; removing part of the initial protective layer to form a protective layer, the protective layer has an opening located on the pad layer, and the protective layer located at the bottom of the opening covers the surface of the pad layer; cleaning the protective layer; after cleaning the protective layer, removing the protective layer at the bottom of the opening to expose the surface of the bonding pad layer. The method for forming the semiconductor structure reduces the crystal defects of the pad layer, thereby improving the bonding effect of the semiconductor structure and improving the reliability of the semiconductor device. |
| priorityDate | 2021-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 23.