| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_267075417ac0355389066d4d4ba14f3f |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02282
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0332
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-467
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0337
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32115 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-311 |
| filingDate |
2020-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_720079d4605cc8d7d8f32dd733f9a21a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_00fd49ad439b76490ae9cbd559d89a1d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_60cc0222c3f100fdc38a78465a020648 |
| publicationDate |
2022-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-114127895-A |
| titleOfInvention |
Planarization of semiconductor devices |
| abstract |
In certain embodiments, a method for treating a substrate includes applying a surface treatment to a selected surface of the substrate. The substrate has an uneven topography including structures defining recesses. The method further includes depositing a fill material on the substrate by spin-on deposition. The surface treatment directs the filler material to the recesses and away from the selected surfaces to fill the recesses with filler material without adhering to the selected surfaces. The method further includes removing the surface treatment from the selected surface of the substrate and depositing a planarizing film on the substrate by spin-on deposition. A planarization film is deposited on the top surface as well as the top surface of the fill material. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114609868-A |
| priorityDate |
2019-06-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |