| abstract |
The present disclosure provides a semiconductor element structure having a conductive polymer liner and a method for fabricating the semiconductor element structure. The semiconductor device structure has a first metal layer and a second metal layer, the first metal layer is disposed on a semiconductor substrate, and the second metal layer is disposed on the first metal layer. The semiconductor element structure also has a conductive structure disposed between the first metal layer and the second metal layer. The conductive structure includes a first conductive through hole and a first conductive polymer pad, and the first conductive polymer pad surrounds the first conductive through hole. |