http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114121866-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3e8e5edbf5a0f8e1e49186a7b3b4c714 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-4903 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4952 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4821 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49541 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49537 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-495 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48 |
| filingDate | 2021-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6a704273cad4bfc6a0511452b881e52e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_abcaf0af3c8711e9d2a00a1ec98fef66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2f2a2acc84bc5a0583bd709d11995bdf |
| publicationDate | 2022-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-114121866-A |
| titleOfInvention | Manufacturing method of lead frame assembly and semiconductor circuit |
| abstract | The invention relates to a lead frame assembly and a manufacturing method of a semiconductor circuit. The lead frame assembly includes a plurality of lead frames and frame connecting parts, wherein each lead frame is provided with a plurality of pins arranged at intervals along the length direction of the lead frame, and the frames are connected to each other. The frame connecting portion is provided with a plurality of positioning grooves, so that the adjacent two lead frames are connected in sequence in the longitudinal direction. The lead frame assembly connects multiple lead frames in turn in the length direction of the lead frame through the frame connecting portion, so that in the semiconductor circuit production process, the assembly action of multiple semiconductor circuit production can be completed at one time, thereby saving manufacturing equipment resources, Improve production efficiency, thereby reducing manufacturing costs. |
| priorityDate | 2021-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID452894838 |
Total number of triples: 20.