http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114113960-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_89927f71397278f91e8d3c3e15fd53e7 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2601 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 |
filingDate | 2021-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_62a87d93ca9d8f171cff594638dfbbbd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a2c9ef407e3a079cfa90b7f7651b42c4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1854dbf792162d1e4354080f9ba191f4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2bf89187169c54c7bc8925d1347a4fb9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5df0335a5aac2c7ab7c66af88dc35ca4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_85c43899a643a2e7ce674b6f85a94d42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2be3a3a81ead77b5fd07f155e07fe5a9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6c428eedb9f35fba7ee64938adc3080e |
publicationDate | 2022-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-114113960-A |
titleOfInvention | Preparation method of GCPW calibration piece and GCPW calibration piece |
abstract | The invention provides a preparation method of a GCPW calibration piece and the GCPW calibration piece. The method comprises the following steps: determining the cross-sectional dimension of the transmission line; determining the size of a via hole according to the cross section size and the theoretical highest frequency corresponding to the GCPW calibration piece, wherein a plurality of via holes are uniformly arranged on an upper floor and a lower floor on the front surface of a substrate, on the substrate and the grounding metal on the back surface of the substrate, and the positions of the upper floor or the lower floor, the substrate and the grounding metal correspond to each other to form a through hole; optimizing the size of the cross section to obtain the optimal size of the cross section; and carrying out semiconductor process machining according to the optimal cross section size and the via hole size, carrying out laser resistance trimming on the resistance of the load calibration piece in the machined calibration piece, and carrying out value setting on all the calibration pieces after resistance trimming to obtain the GCPW calibration piece. The invention can reduce the influence of the multimode transmission line and reduce the system calibration system error. |
priorityDate | 2021-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Predicate | Subject |
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isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23985 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID482532689 |
Total number of triples: 20.