http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114075368-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1e0a6eb64ce528b13450a0401b1d26db |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-385 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-011 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-206 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K9-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-2039 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K5-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-38 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K5-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-04 |
| filingDate | 2020-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_391dc7159da07b3bdf0fdd0ef3dfe96a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bc03089d093c32c153e96cfc4cc2e004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0d402ee6c84cefa38094f59cbf1e7581 |
| publicationDate | 2022-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-114075368-A |
| titleOfInvention | Preparation method of high-thermal-conductivity electric-insulation epoxy resin composite material |
| abstract | The invention provides a preparation method of a high-thermal-conductivity electric-insulation polymer composite material, and belongs to the field of polymer composite materials. The invention uses the modified boron nitride as the filler, thereby ensuring the good electrical insulation performance of the composite material when being applied to electronic packaging materials. Meanwhile, a three-dimensional boron nitride sponge network is used, the heat-conducting boron nitride filler is effectively connected together by utilizing the positive and negative charge interaction of boron nitride and polyethyleneimine, a good three-dimensional heat-conducting path is formed, the high-efficiency transfer of heat in the composite material is facilitated, the dopamine modified boron nitride filler is used, the interface connection between the filler and the epoxy resin matrix is effectively improved, the interface thermal resistance between the filler and the matrix is reduced, and the heat-conducting property of the epoxy resin composite material is effectively improved. The formation of the three-dimensional heat conduction path improves the heat conductivity of the composite material, reduces the addition amount of the heat conduction filler and ensures the machining performance of the composite material. |
| priorityDate | 2020-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 39.