| abstract |
The present invention provides a thermosetting resin composition and its use, which is a thermosetting resin composition with low resin fluidity during a hot pressing process, and which can be cured with laser processability, heat resistance, and cooling and heating cycle resistance. and a hardened product with excellent shock absorption. The present invention relates to a thermosetting resin composition, comprising: a polyimide resin, which is a reactant product of a monomer group comprising dimer diamine and tetracarboxylic anhydride; and a hardener, which is selected from epoxy resin at least one selected from the group consisting of a compound, a maleimide compound, an isocyanate group-containing compound, a metal chelate compound, and a carbodiimide group-containing compound; and a filler, the thermosetting resin combination Among them, a cured product obtained by heating the thermosetting resin composition at 180° C. for 60 minutes exhibits a specific storage elastic coefficient at a predetermined temperature. |