http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114047202-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_67ed93caf768608f2b28ed9225757e57 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N2021-0112 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N21-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N21-91 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N21-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N21-91 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N21-78 |
| filingDate | 2021-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2c46c43f8579b50a6c96d9c4f9001fdb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_106b2752bfd479ba805eeb2f2e61619a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_336ef0e4677c9d811a9a2ece64c3568c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_25af85e1014adf4a4f1dfbec61ee735e |
| publicationDate | 2022-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-114047202-A |
| titleOfInvention | Method and device for detecting wafer penetration type defects |
| abstract | The invention provides a detection method and device for wafer penetration type defects, and particularly relates to the field of detection of semiconductor defects. The detection method of the present invention comprises the following steps: providing a wafer accommodating device; placing the wafer to be tested coated with the first solution and the second solution in the wafer accommodating device; vacuuming the wafer accommodating device containing the wafer to be tested And keep it in a vacuum state for a period of time; take out the wafer to be tested and observe the color change of its surface. The color change of the solution on both sides of the wafer is used to determine the location of through-type defects in the wafer. The method is simple and easy to operate, and can improve the detection efficiency of the wafer. The invention also provides a detection device for wafer penetration type defects, which is simple in structure and convenient in operation. |
| priorityDate | 2021-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 43.