http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114032529-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1689 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1655 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1683 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-34 |
| filingDate | 2021-11-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-08-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-08-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-114032529-B |
| titleOfInvention | An electroless nickel plating solution for wafer-level packaging products and an electroless nickel plating process |
| abstract | The invention discloses an electroless nickel plating solution for a wafer-level packaging product and an electroless nickel plating process, comprising the following components with mass concentrations: nickel salt 25-50g/L; reducing agent 30-60g/L; anti-aging agent 10-15g/L; complex complexing agent 5-15g/L; reaction accelerator 50-80mg/L; surfactant 5-10mg/L; stabilizer 0.2-5mg/L inhibitor 20-40mg/L; The oxidant is 60-120mg/L; the carrier is 40-100mg/L; the carrier is a compound of chloride ion and vanadium ion, and the mass concentration ratio is 1: (1-1.5) in the range of configuration and mixing. The ion concentration is controlled between 20-40ppm/L, and the vanadium ion concentration is controlled between 20-60ppm/L; the mass concentration ratio of the antioxidant and the inhibitor during use is 3:1. The solution of the invention ensures the bonding strength between the plating layer and the substrate, so that the nickel plating layer has good adhesion, and the plating layer is uniform; the process not only ensures the uniformity of the electroless plating, but also shortens the electroless plating time. |
| priorityDate | 2021-11-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 60.