http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114029856-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C39-123 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24D18-009 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C39-10 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D18-00 |
| filingDate | 2021-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-114029856-B |
| titleOfInvention | A chemical mechanical polishing pad with high end point detection accuracy, preparation method and application thereof |
| abstract | The invention discloses a chemical mechanical polishing pad with high end point detection accuracy, a preparation method and an application thereof. The chemical mechanical polishing pad has a unique detection window like a "sandwich" structure, including a top layer, a middle layer and a bottom layer. The middle layer is composed of high-refractive index materials, which ensures high end-point detection accuracy during the polishing process. The top and bottom layers ensure that the window block and other parts of the polishing layer have similar polishing performance and compression during the polishing process. performance. The chemical mechanical polishing pad of the invention has the advantages of high end point detection accuracy, less polishing defects and the like, and is suitable for chemical mechanical polishing of magnetic substrates, optical substrates or semiconductor substrates. |
| priorityDate | 2021-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 77.