| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4a768cc4204e21aa7b548a4a537be73c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6d02f8c9c8ef66341b2fe7d5575d4d11 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02A30-14 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B7-0216
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B7-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B7-0291
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B13-0016
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B13-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B7-292 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B7-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B7-28 |
| filingDate |
2021-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a33f9a347ff1945d7d9ea13469d12f4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f561615f206ad5c1b28e844131d23915
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c87f21fd277f6495c567f1223be4a3f9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_239c2588a83304272afe91f6016e0511 |
| publicationDate |
2022-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-113963861-A |
| titleOfInvention |
PI/PEEK composite insulation lapped wire and preparation method thereof |
| abstract |
The invention discloses a PI/PEEK composite insulated lapped wire and a preparation method thereof, wherein the surface of a high-temperature resistant polyimide PI film is subjected to oxidation etching treatment; spraying PEEK emulsion on the surface of the oxidized and etched PI film, and drying to obtain a PI/PEEK composite film; the surface of the metal wire is wrapped with a PI/PEEK composite film and sintered at the temperature of 350-380 ℃ to form an insulating layer on the surface of the metal wire. The preparation method of the PI/PEEK composite insulating lapped wire provided by the invention has important influence on the heat resistance grade of the electromagnetic wire and the reliability and durability of the insulating structure of the electromagnetic wire, is also beneficial to prolonging the service life of electrical equipment such as a motor and the like, and has bright application prospect. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114276574-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114276574-A |
| priorityDate |
2021-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |