| abstract |
The application provides a semiconductor device, which includes a chip and an encapsulation layer covering the chip, the encapsulation layer is formed by curing an encapsulation material; the encapsulation material includes a fluorine-containing epoxy resin; the chemical structural formula of the fluorine-containing epoxy resin is Features: four F elements are directly connected to a single benzene ring; two epoxy groups are also connected to a single benzene ring, and each epoxy group and the benzene ring are also connected with one or more than one CH 2 functional group; the two epoxy groups are located in the ortho, meta or para position of the benzene ring. The present application also provides the fluorine-containing epoxy resin and a preparation method thereof, a packaging material containing the fluorine-containing epoxy resin, and a terminal using the semiconductor device. The encapsulation material has low dielectric constant and dielectric loss, and has excellent heat resistance, thermomechanical properties, mechanical properties and hydrophobic properties, so that the semiconductor device has excellent performance. |