http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113930813-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76879 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-12 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate | 2021-11-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-113930813-B |
| titleOfInvention | Electro-coppering solution applied to wafer-level packaging and electroplating process thereof |
| abstract | The invention discloses an electroplating copper solution applied to wafer level packaging and an electroplating process thereof, wherein the electroplating copper solution comprises the following components: copper salt 70-90 g/L; 150-250 g/L concentrated sulfuric acid; 60-90ppm/L of brightener; leveling agent 10-30 ppm/L; inhibitor 20-40 ppm/L; 60-120 ppm/L of reactive antifouling agent; 60-120 ppm/L of antioxidant; carrier 120-480 ppm/L; the reaction antifouling agent is a compound of ethylene glycol tertiary butyl ether and phosphate ester, and the mass concentration ratio of the ethylene glycol tertiary butyl ether to the phosphate ester is 1:1 when the reaction antifouling agent is used; the carrier is a compound of chloride ions and vanadium ions, and the mass concentration ratio of the carrier to the carrier is 1: (1-5), mixing, wherein the concentration of chloride ions is controlled to be 60-80 ppm/L and the concentration of vanadium ions is controlled to be 60-400 ppm/L when in use; the components are uniformly mixed according to the proportion, the balance is water, and the operation temperature is 15-40 ℃ to form the copper electroplating solution. The coating obtained by the invention not only achieves the effect of filling the wafer packaging micropores without holes and gaps; and the electroplating uniformity effect is good, and the arch rate is low. |
| priorityDate | 2021-11-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 51.