| abstract |
The invention discloses a flexible thermosetting adhesive with low dielectric loss and a preparation method thereof. In terms of solvent-free, it is composed of the following components: 10-30 parts by mass of bisphenol A cyanate ester, 10-40 parts by mass of allyl-modified bismaleimide, and 5-40 parts by mass of epoxy-modified rubber. 50 parts by mass, 0.005-1.0 parts by mass of curing accelerator and 0-40 parts by mass of filler; wherein epoxy modified rubber is SBS block copolymer, or SIS block copolymer, or SIBS block copolymer in the molecular chain The product whose double bond is partially epoxidized has an epoxy equivalent weight of 1000-2500 g/eq. The thermosetting adhesive has good flexibility when used in flexible copper clad laminates, extremely low dielectric constant, dielectric loss and water absorption, high peel strength and excellent resistance to dip soldering. The adhesive force of the foil is high, the source of raw materials is not limited, and the preparation method is simple and easy. |