| abstract |
The invention relates to a heat-conducting epoxy potting material. The encapsulating material is prepared by compounding and encapsulating organic components of epoxy resin, a diluent, a curing agent, an accelerator and a heat-conducting inorganic filler at room temperature, and curing is completed at 40-60 ℃. According to the invention, the heat conduction efficiency of the solidified encapsulating material is improved through the heat-conducting inorganic filler, the interaction between the heat-conducting inorganic filler and the epoxy resin matrix is obviously improved through the functional curing agent, and the heat conduction and mechanical properties are favorably improved. The epoxy encapsulating material does not contain harmful volatile matters, and is beneficial to environmental protection. |