| abstract |
The present invention provides a thermally conductive resin composition capable of maintaining high thermal conductivity, and a thermally conductive sheet using the same. The thermally conductive resin composition contains an addition reaction silicone resin, a hindered phenolic antioxidant, a thiol antioxidant, a dispersant having a hydrophilic functional group and a silicone chain, and a thermally conductive filler, wherein 65 to 90% by volume thermally conductive filler. |