http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113861623-A

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filingDate 2021-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d524bbe40e1fcba1ec068a95bdf26c9
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publicationDate 2021-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-113861623-A
titleOfInvention A kind of preparation method of thermally conductive LCP composite material
abstract The invention relates to the technical field of thermally conductive materials, in particular to a method for preparing a thermally conductive LCP composite material. The invention firstly grafts an organosiloxane on a thermally conductive filler, and then obtains the modified material through C=C radical polymerization on the organosiloxane. Then, the thermal conductive filler is mixed with LCP and ammonium bicarbonate, and a continuous three-dimensional thermal conductive network is obtained through the pyrolysis of ammonium bicarbonate, so as to build a continuous heat dissipation path in the LCP matrix, and finally immerse it The thermally conductive LCP composite material is obtained in epoxy resin. In the present application, by modifying the thermally conductive filler, and further improving the surface properties between the thermally conductive filler and the liquid crystal polymer, the agglomeration force is reduced, thereby improving the mechanical properties of the LCP composite material. The LCP composite material obtained by the application has both excellent mechanical strength and thermal conductivity, so that it can better meet the application requirements.
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