http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113844070-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4a4ece3bbe30991611a10ca2a7b3d015 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04M1-185 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29D7-01 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04M1-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29D7-01 |
| filingDate | 2021-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a642e055080595af43681a3128705540 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1807659c3c2ccf5d730fefd68b6578d1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_be7338785de6bac312e81a925bb3613f |
| publicationDate | 2021-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-113844070-A |
| titleOfInvention | A production process for the back cover of a mobile phone with a double-grained and double-plated composite plate |
| abstract | The production process of the double-grained and double-plated composite plate mobile phone back cover of the present invention is processed through the following steps, including a composite plate treatment process, a diaphragm treatment process and a lamination process. The single-plated composite board carrier, the film processing process forms a single film, the base film on the single film is torn off, and is pasted with the electroplating layer of the composite board carrier through OCA glue. It is enough to carry out defoaming treatment. Compared with the prior art, the use of separately provided diaphragms to bond with the composite board enables the entire back cover of the composite board to have the visual effect of double-grain double-plating, the entire process is simple, and the yield rate of the double-grain and double-plated composite board is corresponding. The higher, double-grained and double-plated setting makes the entire back cover of the phone more rigid, eliminating the need to add hardening fluid on the PMMA surface of the composite board. |
| priorityDate | 2021-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 19.