| abstract |
The invention provides a resin film, a high-frequency circuit board and a manufacturing method thereof, wherein the resin film does not reduce the low dielectric property and heat resistance of a film for the high-frequency circuit board and the like made of polyarylene ether ketone resin, and can improve the heating dimensional stability. A resin film (1) which comprises 100 parts by mass of a polyarylene ether ketone resin and 10 to 80 parts by mass of a nonswelling synthetic mica. Since the resin film (1) is molded by using the molding material (4) containing non-swelling synthetic mica, the linear expansion coefficient can be reduced. Therefore, the heating dimensional stability of the resin film (1) can be improved, and the difference in heating dimensional characteristics from the metal layer made of metal foil (2) or the like can be suppressed, and the high-frequency circuit board can be prevented from curling or deforming when the high-frequency circuit board is manufactured by laminating the conductive layer (3). |