http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113766760-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fdfa1193040d203a8e1f329ca2ac1c80 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-072 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-244 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-26 |
| filingDate | 2021-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6bc42e3e276a8c24ec9dc48c410038bc http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7bbd7591d6bbe6368180bcb58f1d867c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_027dcf96e4f3f6fb138535fb8bcfa278 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7956b5d6362b1b33d4f27d6c5af7da2f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9efa52a2270180c8c958a16d3a450f1c |
| publicationDate | 2021-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-113766760-A |
| titleOfInvention | Electroless silver plating method for printed circuit boards |
| abstract | The invention discloses a method for electroless silver plating of a printed circuit board, comprising the following steps: S10, degreasing the surface of the copper layer of the printed circuit board, and washing it with water; S20, performing micro-drying on the surface of the copper layer treated in the step S10. etched, washed with clean water; S30, the printed circuit board processed in step S20 is pre-dipped in a pre-dipping solution at 25-35 °C, and then immersed in an electroless silver plating solution, and carried out at 45-55 °C Immersion silver treatment, rinsed with water; wherein, the chemical silver plating solution includes components with the following concentrations: 0.2-5.0 g/L silver ions, 1.0-100 g/L complexing agent, 0.1-10 g/L copper ions, 0.01 g/L ~100g/L surfactant and 0.01~10g/L copper antioxidant. By adding a surfactant, the invention effectively promotes the exchange of the solution, alleviates the void phenomenon of the copper layer under the silver, and can control the silver deposition efficiency; the chemical silver plating solution with a specific formula is used to carry out the silver immersion treatment at 45-55 DEG C, so that the The deposition rate is controlled at 0.10-0.15 μm/min, which avoids the formation of too many voids in the copper layer under silver due to the excessively fast replacement reaction rate. |
| priorityDate | 2021-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 100.