| abstract |
The invention relates to the technical field of sensors and discloses a sensor packaging structure and a sensor packaging process. According to the sensor packaging structure and the sensor packaging process, the conductive pins and the plastic package body are integrally designed, the plastic package body does not need to be damaged when the conductive pins are led out, the conductive pins can be led out of the outer side of the housing, the redistribution layer connected with the conductive pins can be independently arranged outside the housing, so that the sensor is not restricted by the space of the sensor, the space of the sensor is saved by adopting a material with low conductive resistance, the connecting holes are also plugged by wax, and the resistance is further reduced while the sealing performance is further improved. |