http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113741157-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_17634fb17acc415724972a3af3778c89
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-40
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40
filingDate 2021-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4f8fec6567362b434f464c91de2b4657
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d2b173a79558226c522a604c28ddccb9
publicationDate 2021-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-113741157-A
titleOfInvention Environment-friendly fixing method in chip manufacturing process
abstract The invention provides an environment-friendly fixing method in a chip manufacturing process, which comprises the following steps: and developing to remove the unexposed photoresist on the silicon wafer, and fixing to remove the residual developing solution and a small amount of impurities in the working procedure. The developing solution is a developing solution commonly used in the chip industry, namely a hydrocarbon solvent, the developing temperature is 25 ℃, the developing time is one minute, the fixing solution is pure water, or a little alcohol solvent, alcohol ether ester solvent, ketone solvent, surfactant with certain volatility and nonionic surfactant are compounded in the pure water. The invention abandons the common conventional organic photographic fixing solution technology in the industry at present, adopts the water-based substance as the photographic fixing solution, not only greatly reduces the purchase cost of the conventional photographic fixing solution and the treatment cost of hazardous wastes generated by the conventional photographic fixing solution, but also reduces the discharge amount of VOC in the chip industry, makes certain contribution to the environment-friendly and environment-friendly sustainable development, and has higher economic benefit and social benefit.
priorityDate 2021-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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