http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113736401-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f2f64efb02b3af82b4be66ec36bdf453 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-206 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2201-08 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-125 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J179-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-04 |
| filingDate | 2021-09-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b251c04ae9a40063739fa914bf13e7a9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_86642122891b853c4edd50155a51ebc1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f9190fb18d3ac14e3cc632ec7fc716e9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_63fa64728893675f287cebb53ebe9533 |
| publicationDate | 2021-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-113736401-A |
| titleOfInvention | A kind of high heat-resistant one-component adhesive and preparation method thereof |
| abstract | The invention discloses a high heat-resistant one-component adhesive and a preparation method thereof, which is characterized in that: the high heat-resistant one-component adhesive is made of 5-30 parts by weight of toughened modified bismaleimide resin , 15-55 parts by weight of epoxy resin, 0.1-5 parts by weight of epoxy reactive diluent, 3-18 parts by weight of latent curing agent, 0.01-0.5 part by weight of defoamer, 0.01-0.5 part by weight of wetting and dispersing agent, 0.1-5 parts by weight of catalyst and 5-60 parts by weight of inorganic filler are mixed to form. The preparation method is as follows: firstly, the bismaleimide resin is prepared and treated by toughening and modification, and then mixed with other raw materials in a vacuum planetary mixer. The high heat-resistant one-component adhesive of the present invention has the characteristics of gentle heat release during curing, high heat resistance, high toughness, low thermal expansion coefficient, high and low temperature impact resistance of the cured product, etc., and is suitable for heat resistance and environmental temperature requirements. Bonding and sealing of electronic and electrical components, metal and non-metal devices. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114231230-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114231230-A |
| priorityDate | 2021-09-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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