| abstract |
Provided are curable resin compositions whose cured products have both excellent heat resistance and dielectric properties, and cured products thereof, prepregs, circuit boards, semiconductor sealing materials, and semiconductor devices having these properties. The curable resin composition of this invention contains the maleimide (A) which has an indane skeleton, an amine compound (B), and an epoxy resin (C), It is characterized by the above-mentioned. |