| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1ade5e591865e50793668124445c4d4b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0999e927a17fb2185c5247b2acaaacfe |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-3045
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-2227 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J177-06 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J177-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04 |
| filingDate |
2021-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d28ce4d804a7440ca0886beabe4fe198
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_806c3dac221963b0f1d4ebfd004a8516
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9738c7767315044a5ee4ecdc45d90032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3f9ddb786662ad487e761a4eacc5b100
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c8fa284d513a64f07d87aec43ed6039a |
| publicationDate |
2021-11-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-113667447-A |
| titleOfInvention |
A kind of polyamide hot melt adhesive and its preparation method and application |
| abstract |
The invention relates to a polyamide hot-melt adhesive and a preparation method and application thereof. The preparation raw materials of the polyamide hot-melt adhesive include the following components: dibasic acid, diamine, catalyst and heat-conducting seed; the The dibasic acid includes a combination of dimer acid and other dibasic acids; the mass percentage of the thermally conductive seeds is 1%-2.1% based on the total mass of the raw materials for preparing the polyamide hot melt adhesive as 100%. The polyamide hot-melt adhesive of the invention has the advantages of fast crystallization rate, low viscosity, good wettability, oil resistance and insulation, and also has the advantages of fast solidification rate, which can improve the molding rate of products and further improve the production of injection molding process pairs. efficiency. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114619627-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114619627-A |
| priorityDate |
2021-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |