| abstract |
The present application discloses a molding compound for chip encapsulation and an encapsulation structure, wherein the epoxy resin used in the molding compound has flexible units such as polyether, and the compounding of components such as a curing agent and a diluent realizes good flexibility It has good properties and strength, and effectively reduces warpage. The warpage can be reduced to 0mm, and the modulus can reach more than 8GPa. It has good silicon adhesion and can effectively protect the silicon wafer from bending cracks due to warpage. In addition, by adding the p-tert-butylphenol epoxy resin diluent, the influence of the monofunctional aliphatic diluent on the curing system can be further effectively reduced, and the flexibility and modulus of the molding compound can be further improved. |