http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113611648-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P70-50 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B65G15-58 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B65G47-912 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67766 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67781 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-1804 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B65G47-91 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-677 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B65G15-58 |
| filingDate | 2021-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-113611648-B |
| titleOfInvention | Full-automatic intelligent overturning and folding double-wafer inserting machine for silicon wafers |
| abstract | The invention discloses a full-automatic intelligent overturning and stacking double-piece silicon wafer inserting machine for silicon wafers, which belongs to the technical field of silicon wafer production and comprises a base, wherein a material conveying mechanism is fixedly arranged at the bottom of an inner cavity of the base and used for conveying a silicon wafer main body, a linear module is fixedly arranged at the top of the inner cavity of the base, a grabbing mechanism is fixedly arranged at the bottom of the linear module and used for grabbing the silicon wafer main body and conveying materials, and an inserting piece mechanism is fixedly connected to one side of the top of the base. According to the silicon wafer inserting device, the silicon wafer main body in the feeding groove moves under the action of liquid flowing out through the pressurizing nozzle on one side, the impact force of medium flowing can drive the silicon wafer main body falling into the groove through the guide plate on one side and the silicon wafer main body is inserted into the groove of the inserting piece clamp, so that when the inserting piece processing of the silicon wafer main body is realized under the action of fluid, on one hand, the inserting piece efficiency can be ensured, on the other hand, the inserting piece safety is synchronously improved, the abrasion of the surface of the silicon wafer main body due to the contact friction of the inserting piece mechanism is avoided, and the inserting piece processing requirement is met. |
| priorityDate | 2021-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 22.