http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113604172-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e74f5d709d350f415e6ca3779caa68d3 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-035 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-025 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J123-0853 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J123-08 |
| filingDate | 2021-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2fbb2643a1eb3b560ecc844c5c852100 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4d25c4eeb804194c17448cd2e3c274a1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cc114300bdf5192203e380825c3b8fd9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4a392f44e0be3fd23d30582370f597f5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b56827d2d052b38625f2ec3d242f0c76 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5671fa2066b99304e79501cff8ff299c |
| publicationDate | 2021-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-113604172-A |
| titleOfInvention | A kind of high and low temperature resistant hot melt adhesive, its preparation method and application |
| abstract | The invention belongs to the technical field of adhesive materials, and discloses a high-low temperature resistant hot melt adhesive, a preparation method and application thereof, and the high and low temperature resistant hot melt adhesive comprises a high-melting index base material, a low-melting index base material and a dispersion-assisting base material ; The melt index of the high-melt index base material is greater than 300g/10min, the low-melt index base material is less than 100g/10min, and the melt index of the auxiliary dispersion base material is between the high-melt index base material and the low-melt index base material; The auxiliary dispersing base material is used to disperse the high-melting index base material and the low-melting finger base material evenly during the mixing and granulation process; all three are ethylene copolymers. The hot melt adhesive of the present invention is used for the inner rubber layer of the double-wall heat shrinkable sleeve, and can meet the GMW17136 standard, and can also meet the low temperature flexibility test stipulated in the ASTMD2671 standard. Performance requirements such as aging test in high temperature environment. |
| priorityDate | 2021-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 48.