http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113584547-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-08 |
| filingDate | 2021-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-113584547-B |
| titleOfInvention | A kind of preparation method of micro-nano metal particle surface coating |
| abstract | The invention discloses a preparation method for the surface coating of micro-nano metal particles, belonging to the field of surface engineering. The method is as follows: selecting and configuring a plating solution for electroplating, selecting the micro-nano metal particles to be electroplated, removing the surface oxide film on the selected micro-nano metal particles, mixing with the weakly acidic plating solution and adding it into the electroplating tank, and then electroplating. Add a magnetic rotor to the tank to stir the electroplating solution, so that the micro-nano metal particles are evenly dispersed in the electroplating solution, and the stirring does not stop during the electroplating process, turn on the power supply of the micropump, make the electroplating solution circulate stably in the microtube, turn on the electroplating power supply, and conduct electroplating , after a certain period of time, the electroplating is completed, and the electroplated plating solution is centrifuged and dried to obtain micro-nano metal particles with good plating. The invention can be applied to solder balls in the field of electronic packaging such as flip chip bonding and ball grid array packaging, and has the advantages of low resistance, strong signal transmission capability, strong electromigration resistance and creep resistance. |
| priorityDate | 2021-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 26.