| abstract |
An object of the present invention is to provide a resist underlayer film formation capable of forming a flattened film by applying a process to a substrate and then heating it to express high reflow property, and to apply flat coating even on a substrate with a difference in height. combination. The solution is that the composition for forming a resist underlayer film of the present invention is a composition for forming a resist underlayer film containing a repeating structural unit represented by the formula (1) and/or represented by the formula (2). A copolymer of the repeating units shown, and an organic solvent. (In formula (1) and formula (2), R 1 represents a functional group represented by formula (3), and in formula (3), Q 1 and Q 2 each independently represent a hydrogen atom or a carbon number of 1 to 5 The alkyl group, * represents a bond terminal with an oxygen atom, in formula (2), X 1 represents an organic group having 1 to 50 carbon atoms, and i and j each independently represent 0 or 1.) |