| abstract |
The present invention provides a thermally conductive silicone gel composition, which not only has high thermal conductivity, but also has excellent extrudability and mixing stability. It can be stored in a safe place and has excellent gap filling properties for heat-dissipating parts and the like. The invention relates to a multi-component thermally conductive silicone gel composition and use thereof. The thermally conductive silicone gel composition contains the following components: (A-1) alkenyl-containing polyorganosilicon with a degree of polymerization of 5-100 Oxane, (A-2) alkenyl-containing polyorganosiloxane with a degree of polymerization of 400 or more, (B) organohydrogenpolysiloxane, (C) catalyst for hydrosilylation reaction, (D) thermally conductive filler, (E) silane coupling agent, etc. and (F) polyorganosiloxane having a hydrolyzable silyl group at the end of the molecular chain, the mixed viscosity of component (A-1) and component (A-2) is determined in component ( A-1) It exists in the range of 1.15-5.50 times the viscosity at 25 degreeC. |