http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113501957-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_26e17b36a8d86c22d85ec9676ab1312b
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1046
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10
filingDate 2021-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de9da7fbde0d477abb4c2084413544db
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_000f8d55ef6dd6d8fbb8e4ecae6ca862
publicationDate 2021-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-113501957-A
titleOfInvention A kind of low temperature molding thermoplastic polyimide and preparation method thereof
abstract The invention discloses a low-temperature molding thermoplastic polyimide and a preparation method thereof. The method combines 2,2-bis(4-(3-aminophenoxy)phenyl)propane and pyromellitic dianhydride, 4,4, One of 4-biphenyltetracarboxylic dianhydride, 4,4-benzophenone tetracarboxylic dianhydride or 4,4-biphenyl ether dianhydride is dissolved in a solvent, and reacted at room temperature for 4-8h to obtain polyamide imine solution; then heating and refluxing for a certain period of time to evaporate the solvent to obtain polyimide powder, washing with ethanol or methanol to obtain the finished polyimide resin, and the glass transition temperature of the polyimide obtained by the present invention is 160-210 ℃, the molding processing temperature is 260-320 ℃, which greatly reduces the molding processing temperature of polyimide resin, reduces processing conditions and saves energy.
priorityDate 2021-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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