http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113484111-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b5b43f4a86fc8f7ad28689d833acac53 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N2001-2873 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N1-286 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N1-28 |
| filingDate | 2021-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_86f2e9a1857030527d0614e42c8957d7 |
| publicationDate | 2021-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-113484111-A |
| titleOfInvention | A kind of preparation method of TSV sample |
| abstract | The present application relates to the technical field of semiconductor device manufacturing processes, and in particular, to a method for preparing a TSV sample. A first metal layer is deposited on the bottom of a through hole of each TSV, the first metal layer covers the bottom of the through hole, and a pre-configured adhesive is filled to the inner wall of the middle of the through hole of each TSV of the sample to be processed; deposit a second metal layer over the through hole of each TSV, and the second metal layer covers the upper part of the opening of the TSV through hole; deposit a cover layer over the second metal layer , to obtain a pretreated sample to be treated; use a dual-beam plasma ion beam PFIB to cut the pretreated sample to be treated according to a preset cutting method to form a TSV sample exposing each TSV cut section. In this way, by filling the inner wall in the middle of the through hole of each TSV, and depositing to form a cover layer, the curtain effect and address depression due to I-Beam irradiation can be avoided, thereby improving the accuracy of the dimension parameter measurement of the TSV. |
| priorityDate | 2021-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 15.