http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113416988-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-01 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76879 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00301 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-16 |
| filingDate | 2021-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-113416988-B |
| titleOfInvention | A kind of electroplating method |
| abstract | The invention discloses an electroplating method, comprising the steps of: forming a patterned conductive seed layer on a substrate to be plated; forming an electroplating mask pattern on the substrate to be plated and the patterned conductive seed layer, the electroplating mask The groove pattern of the film pattern corresponds to the part that needs to be thickened; a metal material is filled in the groove pattern of the electroplating mask pattern to obtain a thickened metal pattern. With the above solution provided by the present invention, a groove pattern is formed above the position where the patterned conductive seed layer needs to be thickened, and the metal wire formed by filling metal in the groove pattern is directly connected to the patterned conductive seed layer, which directly increases the part of the patterned conductive seed layer. The thickness of the conductive element can be precisely controlled according to the thickness requirements during electroplating. The local coating thickness can be precisely controlled. |
| priorityDate | 2021-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 41.